1. Introduction 1.1. Project/Component Working Name: Turgo Platform binding 1.2. Name of Document Author/Supplier: Yu Kong 1.3. Date of This Document: 09/14/07 1.4. Name of Major Document Customer(s)/Consumer(s): 1.4.1. The PAC or CPT you expect to review your project: HS PAC 1.4.2. The ARC(s) you expect to review your project: FWARC 1.4.3. The Director/VP who is "Sponsoring" this project: Mike.Sanfratello@Sun.com 1.4.4. The name of your business unit: Systemes Group 1.5. Email Aliases: 1.5.1 Responsible Manager: chad.solomon@sun.com 1.5.2 Responsible Engineer: yu.kong@sun.com 1.5.3 Platform program Manager thomas.paolucci@sun.com 1.5.4 Engineering Manager: marv.wexler@sun.com 1.5.5 Interest list: turgo-eteam@sun.com 2. Project Summary 2.1. Project Description: Turgo 2U AC/DC systems are the next generations of CMT 20" rack servers for Telecom market. Turgo is based on Niagara-II processor, and it is leveraged from Huron motherboard. The Turgo system will provide the following hardware features, + Niagara 2 CPU, 1.20 Ghz 8/6 cores , 8 threads/core + 16 FB-DIMM slots support 1,2,4 and 8 GB memory (max 128 GB) + One x8 dedicated PCI-E slots and support two x1,x2,x4 and x8 low profile PCI-E card with riser card + One x16 PCI-E connector slot + Two Combination PCI-E 4 lane/XAUI slot + Two 133 MHz PCI-X slots + 10 Gb XAUI/ 1 Gb SERDES interface for fabric interface + 4 10/100/1000 BaseT Ethernet for base interface + 2 USB 2.0 capable ports + Two SAS drivers supported with a slot load DVD-RW drive or Four SAS drives supported without DVD-RW drive + 1 Serial POSIX compliant DB9 port + Power PC based service processor hardware supporting both RJ45 serial interface and 10/100 base ethernet + 2x Hot-plug/hot-swap AC/DC 650W power supplies + Telco alarm card The purpose of this document is to describe OpenBoot firmware deliverable for Turgo platform. 2.2 Risks and Assumptions: Assumptions: ------------ - Turgo OepnBoot code will be leverage from Huron OpenBoot. There is no OpenBoot code change. - All Huron related FWARC cases are reviewed and approved prior to Turgo release. 3. Business Summary 3.1. Problem Area: This one pager provides information about properties and name provided by Turgo at the system firmware level, which must be registered with FWARC. 3.2. Market/Requester: NSN 3.3. Business Justification: N/A 3.4. Competitive Analysis: N/A 3.5. Opportunity Window/Exposure: Required for Turgo RR 3.6. How will you know when you are done?: When the related code changes are integrated into 4.x gate. 4. Technical Description: 4.1 New Development 4.1.1 OpenBoot properties Turgo will have the following root name "name" and "banner-name" properties. "name" Type: Prop-encoded-string Contents: Root node name property for Turgo Value: "SUNW,Netra-T5220" "banner-name" Type: Prop-encoded-string Contents: Banner name for Turgo Value: "Sun Netra T5220" 4.2 Interaces: Inported Interfaces: Interface Classification Comments "name" Standard FWARC/1998/392 (Standard IEEE 1275 Property) "banner-name" Stable FWARC/1998/392 (Legacy Property) Exported Interfaces: "SUNW,Netra-T5220" Uncommitted "name" property value "Sun Netra T5220" Uncommitted "banner-name" property value 5. Reference Documents: [1] Standard IEEE 1275 Property FWARC/1998/392 http://sac.sfbay/Archives/CaseLog/arc/FWARC/1998/392 [2] Host Types for Sun4v platforms http://sac.eng.sun.com/arc/FWARC/Registries/Host_Type_Registry.txt 6. Resources and Schedule: 6.1. Projected Availability: Q4 FY07 6.2. Cost of Effort: 4 man month 6.3. Cost of Capital Resources: Need access to a dedicated Turgo system for OpenBoot/vBSC development during P0, P0.1 and P1 stages. 6.4. Product Approval Committee requested information: 6.4.1. Consolidation or Component Name: OpenBoot 6.4.3. Type of CPT Review and Approval expected: FastTrack 6.4.4. Project Boundary Conditions: 6.4.5. Is this a necessary project for OEM agreements: No 6.4.6. Notes: 6.4.7. Target RTI Date/Release: 6.4.8. Target Code Design Review Date: 6.4.9. Update approval addition: 6.5. ARC review type: FastTrack 7. Prototype Availability: 7.1. Prototype Availability: 7.2. Prototype Cost: